| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device housing package, which is capable of effectively preventing noises from penetrating into a semiconductor device and keeping it to operate normally for a long period. SOLUTION: A semiconductor device housing package is composed of an insulating base 1, equipment with a mounting pad 1a mounted with a semiconductor device 3 on its upside and wiring layers 5 led out from the mounting pad 1a to its underside, and a lid 2 which seals up the semiconductor device 3 mounted on a mounting pad 1a. At this point, the insulating base 1 is a sintered body, which contains at least one of crystalline phases such as quartz, cristobalite, tridymite, enstatite, and forsterite and is obtained by burning a molded body which comprises 20 to 80 vol.% lithium silicate glass that includes 5 to 30 wt.% Li2 O and whose yield point is 400 to 800 deg.C and 20 to 80 vol.% filler of at least one selected from among quartz, cristobalite, tridymite, enstatite, and forsterite, and a magnetic insulating layer 8 is deposited around the wiring layer 5 formed on the underside of the board 1.
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