| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an SMC molding material in which the generation of shrinkage voids and pin holes is reduced at the time of molding and also manufacture its molded product. SOLUTION: In a thick wall sheet molding compound (hereinafter referred to as SMC as an abbreviation) in the sandwich shape between two thermoplastic films, its unit weight is 6-30 kg/m<2> , the fiber reinforced material content is 13-70 wt.%, the thickness is 4-30 mm and the molded product specified gravity is 1.5-2.1, and the sheet molding compound wrapped in the sandwich shape into the thermoplastic film is formed into a multilayer structure formed at least of a resin compound/the fiber reinforced material/the resin compound/the fiber reinforced material/the resin compound, and a hollow filler is not contained in the resin compound, and said resin compounds are composed of same resin and impregnated in the fiber reinforced material, and the orientation of the fiber reinforced material is at random. |
