| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP polishing device to provide a high polishing speed without damaging uniformity of polishing. SOLUTION: Vibration is generated by a vibration generating device 16 and a vibration is transmitted to a polishing body 11. Since a vibration generating device 16 is arranged at the central part of a disc-form polishing body 11, vibration of the polishing body 11 is generated from a center and diffused to a periphery. The vibration is absorbed by a vibration absorbing part 17 arranged at the end part of the polishing body 11. Vibration of the polishing body 11 forms a progress wave progressing from a center to a periphery. Abrasives 15 fed to the vicinity of the central part of the polishing body 11 is carried accompanied with a progress wave and enters between the polishing body 11 and an object 13 to be polished. Thus, the abrasives is reliably fed to the deep side of an object to be polished and even when a relative speed between the polishing body and the object to be polished in increased and a pressure to press the object to be polished against the polishing body is increased the uniform polishing can be executed. |
