| 摘要 |
PROBLEM TO BE SOLVED: To prevent a decrease in mechanical strength of semiconductor members and to easily position the semiconductor members when soldering them, by forming a film having no affinity with solder such that the film surrounds the semiconductor members on the surface of a semiconductor pattern and is thinner in thickness than the soldering layer of the semiconductor members. SOLUTION: A resist material is an epoxy base material having no affinity with solder and the surface of a copper foil 9 surrounded by a resist pattern 10 is made almost same in size as the joint surface of a semiconductor chip to the copper foil 9. This can easily accurately position semiconductor members such as a semiconductor chip 3 and an external output terminal 4 in the place surrounded by the resist pattern 10 by the use of the surface tension of fused solder during a soldering operation. Further, since the copper foil 9 has no slit-shaped cutaway, stress concentration is not produced in a ceramic substrate 1 by thermal strain caused by a difference in thermal expansion coefficient between the ceramic substrate 1 and the copper foil 9 during the soldering operation.
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