发明名称 APPARATUS FOR BENDING OUT-GOING LEADS OF SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To easily and surely bend out-going leads arranged at small pitches by providing means for disposing at another side in at least one a first and a second outer leads bending at least one of first and second out-going leads in cooperation with support blocks. SOLUTION: A bender 10 is disposed at one side of each of out-going leads 3a, 3b, means 14 for bending all the leads 3a, 3b is disposed at the other sides of all the leads 3a, 3b and support blocks 12 for receiving all the leads 3a, 3b. Bending members 18, 20 face the support blocks 12 through the leads 3a, 3b, and are disposed at an initial position parallel to first bearings 12P of the blocks 12. The bending member 18 rotates for bending the lead 3a cooperating with the support blocks 12.
申请公布号 JPH1197604(A) 申请公布日期 1999.04.09
申请号 JP19970250485 申请日期 1997.09.16
申请人 FUJITSU LTD 发明人 MUGITANI HIROSHI
分类号 B21F1/00;H01L23/50;(IPC1-7):H01L23/50 主分类号 B21F1/00
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