| 摘要 |
PROBLEM TO BE SOLVED: To provide a relay substrate with its high durability and reliability in which interconnection between a substrate and a mounting substrate is facilitated in a relay substrate intervened between the substrate and the mounting substrate to connect both, and moreover displacement is hardly made by vibration and shock during connection. SOLUTION: A relay substrate 10 is formed in a substantial shape having first and second faces 1a and 1b, comprises a relay substrate body 1 having a plurality of through holes H penetrating between the first and second faces 1a and 1b, and a second protrusion 6b protruded from the second face 1b, and a tip end 6s of the second protrusion 6b has a soft metal body 6 formed on a flat face. This relay substrate 10 is intervened between a substrate 20 having a face connection pad 22 and a mounting substrate 40 having a face connection mounting pad 42, and the substrate and the mounting substrate 40 are connected to each other. |
