| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the insufficient continuity between solder balls and the wiring terminals of a mounting substrate, by conducting mounting work by adjusting the solder balls so that the bottom faces of the balls may become horizontal through shrinking of shrinkable adjusting bodies in mounting, by interposing the adjusting bodies between through hole conductors and the solder balls. SOLUTION: Through hole conductors 6 electrically connected with a lead frame 3 are provided on the substrate 1 of a semiconductor device, by plating the internal surfaces of through holes 7 formed through the substrate 1 with copper 8 and the lower-end peripheral sections 9 of the holes 7 with gold so that the conductors 6 may have electrical continuity. Then, shrinkable adjusting bodies (m) composed of a conductive material are respectively interposed between the conductors 6 and solder balls M. Therefore, when the lower end faces of the solder balls M are forcibly positioned horizontally through the adjusting bodies (m) in a case where the substrate 1 warps, the occurrence of insufficient continuity between the solder balls and the wiring terminals of the substrate 1 caused by the warp of the substrate 1 can be eliminated.</p> |
