| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the alkaline component in the atmosphere of a processing system, which is provided with a device for liquid treatment and heat treatment of a wafer by using pure wafer and to suppress microbes generation in the pure wafer. SOLUTION: Lower air in a down flow formed in a processing system is introduced through an introducing port 111 into a filter device 101. The alkaline component is eliminated by causing a vapour-liquid contact of the air and pure wafer which is sprayed from spraying devices 131 and 151 in filing parts 132 and 152 and in vapour-liquid contact spaces M1 and M2. After that, the temperature and humidity of the air are adjusted and the air is introduced into the processing system via a feed pipe 74. The sprayed pure water is used again in the circulation system and at the same time, is sterilized by an ultraviolet ray radiation device 161 and microbes is prevented from generation. |
