Semiconductor component with ball grid substrate (BGA)

摘要

The component includes a semiconductor platelet (2) having several electrodes coupled to conductive lines, while the platelet is linked to solder balls (6) via through holes in insulation layers. One insulation layer has on the surface a first signal lines (9c) of the platelet, a second line (9a), coupled to the current source, and a third earthing line (9b) in a linearly adjacent pattern and parallel to the first line direction.