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发明名称
LEAD WIRE OF IC PACKAGE
摘要
申请公布号
JPH1168012(A)
申请公布日期
1999.03.09
申请号
JP19970228526
申请日期
1997.08.25
申请人
MITSUBISHI ELECTRIC CORP;MITSUBISHI DENKI SYST LSI DESIGN KK
发明人
KASHIWABARA HISAKAZU
分类号
H01L23/50;H05K3/34;(IPC1-7):H01L23/50
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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