| 摘要 |
PROBLEM TO BE SOLVED: To enable prevention of separation of an external electrode from a multilayer ceramic board or a single layer ceramic board, by integrally sintering the multilayer ceramic board, first and second via-hole electrode, and the external electrode. SOLUTION: Ceramic sheets 11a to 11d are stacked and compression-bonded to form a multilayer ceramic board 11. After an external electrode 13 is formed on the surface thereof by printing a copper-based paste-like conductive material by screen printing, the multilayer ceramic board 11, a conductor pattern 12, the external electrode 13, and first and second via-hole electrodes 14, 15 are integrally sintered at a temperature not higher than 1000 deg.C. Thus, the durability of the external electrode against thermal stress or mechanical stress is improved, and consequently, the external electrode can be prevented from being separated from the multilayer ceramic board. |
