| 摘要 |
PROBLEM TO BE SOLVED: To provide the durability of an epoxy resin and to prevent epoxy resin from being peeled off at the time of resin-sealing an electronic element arranged on a ceramic board with the epoxy resin. SOLUTION: In the manufacture method, epoxy resin 6 having a resin material whose linear expansion coefficientαof resin isα<=20 (ppm/ deg.C), and whose relation between the elastic modulus and the linear expansion coefficientαof resin satisfies Eα<1.7> <=1000 (ppm/ deg.C)<1.7> Gpa} is used and resin sealing is executed, so that a fillet angleθbecomesθ<=50 deg.. Namely, durability is secured by selecting the linear expansion coefficientαand the elastic modulus E of resin, and epoxy resin 6 can be prevented from being peeled off from the ceramic board 1 by setting the fillet angleθ. |
