Direct assembly for silicon sensors

摘要

The assembly requires wafers or chips location with respect to other silicon chips. The latter are fitted onto or into chip supports, between which and the silicon chips are made and/or placed wire bond couplings. The chips of other material are coated with an adhesive film and setting the other material chips onto the location region of the Si chips by pick and place technology. Then follows a rough and fine positioning of the chips and the adhesive fixing process is initiated. Then follows a measured lobe or all round casting for preserving, fixing, or hermetic enclosure of the bond coupling.