BONDING PASTE APPLYING DEVICE FOR CHIP MOUNTING,申请号KR19950014084-传众专利搜索

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发明名称	BONDING PASTE APPLYING DEVICE FOR CHIP MOUNTING
摘要
申请公布号	KR0157683(B1)	申请公布日期	1998.12.15
申请号	KR19950014084	申请日期	1995.05.31
申请人	DAEWOO ELECTRONICS CO.,LTD	发明人	KWON, OH-KEUK
分类号	H05K3/30;(IPC1-7):H05K3/30	主分类号	H05K3/30
代理机构		代理人
主权项
地址

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