THE TEST DEVICE FOR SEMICONDUCTOR CHIP PACKAGE,申请号KR19950008339-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	THE TEST DEVICE FOR SEMICONDUCTOR CHIP PACKAGE
摘要
申请公布号	KR0145955(B1)	申请公布日期	1998.12.01
申请号	KR19950008339	申请日期	1995.04.11
申请人	SAMSUNG ELECTRONICS CO.,LTD	发明人	CHON, JE-SUK;CHOE, CHAN-HO;CHO, INN-SUB;SIM, WON-SUB
分类号	G01R31/28;(IPC1-7):G01R31/28	主分类号	G01R31/28
代理机构		代理人
主权项
地址

您可能感兴趣的专利

A COMPOUND ABSORBING SUN LIGHT AND CONVERTING THE SUN LIGHT INTO ELECTRICAL ENERGY, AND METHOD FOR MANUFACTURING THE SAME

Separate apparatus of solar wafer spitter

FIELD EFFECT TRANSISTER, AND ELECTRIC CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FILM SUBSTRATE FORMED WITH FINE CIRCUIT THEREON AND MANUFACTURING METHOD THEREOF

METHOD FOR CALCULATING A TOUCH COORDINATES OF TOUCHSCREEN AND APPARATUS USING THE SAME

METAL AND PVC SEPERATING APPARATUS OF WASTE-WAFER

WASTED STYROFOAM REDUCING APPARATUS

COMPUESTOS PARA INHIBIR LA ACTIVIDAD DE KSP KINESINA

DERIVADOS DE 1H-PIRAZOL-[3,4-d]-PIRIMIDINA, 9H-PURINA Y 7H-PIRROL-[2,3-d]-PIRIMIDINA COMO INHIBIDORES DE CINASA P70 S6

COMPUESTOS TETRAHIDROCICLOPENTA[b]INDOL COMO MODULARES DEL RECEPTOR ANDROGENO

DIFFERENTIAL TRANSMISSION WITH CLEANING FEATURE

AIR-OPERATED VALVE

BINDERS FOR PIGMENTED INK FORMULATIONS

EMBEDDED CAPACITOR CORE HAVING A MULTIPLE-LAYER STRUCTURE

FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRAINE

OIL-, WATER- AND SOIL-REPELLENT PERFLUOROALKYLETHYL METHACRYLATE COPOLYMERS

IMAGE FORMING APPARATUS

METHOD OF MICRONIZATION