| 摘要 |
PROBLEM TO BE SOLVED: To turn a through-hole into a blind hole without carrying out a filling process, where ink material or the like is used so as to surface-mount a part even on the through-hole. SOLUTION: This printed board has a structure such that its base materials 1 and 2 are laminated through the intermediary of a prepreg 3, and a through- hole 4 is provided so as to electrically connect the prescribed circuit parts of the boards 1 and 2 together, wherein a conductive paste 5 is filled only in a part of the through-hole 4 located at the prepreg 3 to turn the through-hole into a blind hole. A copper plating layer 6 is formed on circuit patterns formed on the outer surfaces of the boards 1 and 2, the conductive paste 5, and the inner walls of the blind holes provided to the boards 1 and 2, whereby the circuit patterns formed on the outer surfaces of the boards 1 and 2 and the conductive paste 5 are electrically connected together via the copper plating layer 6. |
