| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board wherein imperfect connection can be reduced in a connection part when inner conductor and surface conductor are different in composition. SOLUTION: A wiring board has inner conductor 2 composed of Ag in glass ceramic main bodies 1a, 1b, and surface conductor 3 which contains Pd of 12-30 pts.wt. to Ag of 100 pts.wt. is formed on the board surface. In this case, third conductor 4 connecting the inner conductor 2 with the surface conductor 3 is composed of composition wherein Pt of 3-5 pts.wt. or Pd of 1-5 pts.wt. to Ag of 100 pts.wt. is contained. The distance L between the inner conductor 2 and the surface conductor 3 is made at least 150μm. Since the third conductor is formed, it acts as a buffer layer at the time of baking, disconnection due to diffusion of Ag between Ag of the inner conductor 2 and Ag-Pd of the surface conductor 3 can be prevented. |
