METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the productivity and reliability when only desired semiconductor chips which are decided to be collected based on the results of probe tests are collected from among wafers by collectively stripping off semiconductor chips from a tape and collecting the chips while the chips are successively irradiated with a spotlight. SOLUTION: When a pipe coupling 4 is evacuated by turning on vacuum suction, a semiconductor wafer 1 is stripped off from a tape and divided into individual semiconductor chips, because the pressure in the space between the wafer 1 and a wafer mount table 3 is reduced. A data inputting and control section 10 receives the results of probe tests conducted on the wafer 1 through a communication line 13. Semiconductor chips to be collected irradiated with a spot light 5 are picked up and housed. All of the semiconductor chips to be collected in the wafer 1 are successively collected by successively irradiating the chips with the spot light 5 by controlling an X-Y stage 8 by operating the data inputting and control section 10.