发明名称 WAFER CONTACT PREVENTIVE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer contact preventive device capable of simplifying troublesome works in manually taking out a wafer, and reducing the man-hour. SOLUTION: A wafer contact preventive device is a device to be mounted on a wafer storage cassette having a wafer arrangement groove to prevent the contact with wafers W, and comprises a rectangular support frame 2, ribs 4 which are inwardly divided in a comb manner are provided opposite to a pair of walls 3, slits 5 between the ribs have the same pitch as the groove pitch of the wafer arrangement groove, and the width D of the slits 5 is smaller than the groove width of the water arrangement groove.</p>
申请公布号 JPH10279071(A) 申请公布日期 1998.10.20
申请号 JP19970087875 申请日期 1997.04.07
申请人 SHIN ETSU POLYMER CO LTD;SHIN ETSU HANDOTAI CO LTD 发明人 OHORI SHINICHI
分类号 B65G49/07;B65D85/86;H01L21/673;(IPC1-7):B65G49/07;H01L21/68 主分类号 B65G49/07
代理机构 代理人
主权项
地址