发明名称 MOLD RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold release film excellent in releasability, cushioning properties and antistatic properties. SOLUTION: This film is constituted by providing a release layer to at least the single surface of a laminated polyester film obtained by laminating a polyester B layer not substantially containing fine air bubbles on at least the single surface of a polyester A layer containing fine air bubbles and simultaneously satisfies 0.40<=D<=1.30, 5<=F<=1500, R<=10<13> , 0.3<=OD and 1<=TA/TB<=500 [wherein D is apparent density (g/cm<3> ) of the mold release film, F is the peeling strength (gf/50 mm width) of the mold release film, R is the surface intrinsic resistance (Ω) of either one of surfaces of the mold release film, OD is the concealing degree of the mold release film, TA/TB is a ratio of the thickness TA (μm) of the polyester A layer and the total thickness (μm) of the polyester B layer].
申请公布号 JPH10278204(A) 申请公布日期 1998.10.20
申请号 JP19970082663 申请日期 1997.04.01
申请人 DIAFOIL CO LTD 发明人 IZAKI KIMIHIRO;OZAKI YOSHIHIDE;INAGAKI MASASHI
分类号 B32B27/36;(IPC1-7):B32B27/36 主分类号 B32B27/36
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