| 摘要 |
PROBLEM TO BE SOLVED: To detect the position of an IC package accurately without the effects of the defective shapes such as chips and burrs on the package. SOLUTION: The boundary of the upper surface and the side surface of a package is detected by hystogram. The linearity of the continuous distribution of respective dots is detected from the differentiated value of the distribution of the boundary points. Furthermore, the straight line of the package boundary is detected by a least square method from the remaining dot after the nonlinear part by a chip part 12 is removed. Furthermore, the intersection point of the detected straight lines in the direction (x) and the direction (y) is made to be an original point 19. The straight lines (x) and (y) are rotated by the equal angle, respectively, so that the cross angle of two straight lines becomes 90 degrees with the original point 19 as the center, and a reference axis X in the direction (x) and a reference axis Y in the direction (y) are computed. Thus, even if there are chips, burrs and the like, the IC position can be accurately detected, and the detecting positions of the defective items on visual inspection, the detecting position of a lead and the like can be accurately set. |
