| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition for sealing an underfill, capable of connecting a semiconductor device such as CSP/BGA, etc., the semiconductor devices on a carrier plate to a circuit board by thermosetting the composition in a short period of time with a good productivity, excellent in (thermal cyclic) heat shock resistance and capable of easily removing the CSP/ BGA on finding a defect. SOLUTION: This thermosetting resin composition is used for an underfill sealing between a semiconductor device 4 holding a semiconductor 2 on a carrier base material 1 and a circuit base plate 5 on which the semiconductor device is electrically connected, and consists of 100 pts.wt. epoxy resin, 3-60 pt.wt. curing agent and 1-90 pt.wt. plasticizer. |
