| 摘要 |
Integrated circuit chips and method of routing the interface pads (12) from the face of the chip or die to one or more sidewall surfaces of the die. The interconnection (14) is routed from the face of the die (11) to one or more edges of the die, then routed over the edge of the die and onto the side surface. A new pad (17) is then formed on the sidewall surface, which allows multiple die or chips to be stacked in a three-dimensional array, while enabling follow-on signal routing from the sidewall pads. The routing of the interconnects and formation of the sidewall pads can be carried out in an L-connect or L-shaped routing configuration, using a metalization process such as laser pantography. |
