发明名称 SUPPORT FOR WAFER-SHAPED OBJECTS, IN PARTICULAR SILICON WAFERS
摘要 PCT No. PCT/AT96/00063 Sec. 371 Date Feb. 18, 1998 Sec. 102(e) Date Feb. 18, 1998 PCT Filed Apr. 1, 1996 PCT Pub. No. WO97/03457 PCT Pub. Date Jan. 30, 1997In a support for a wafer-shaped object, in particular a silicon wafer, there is an annular nozzle in the surface of the support opposite the wafer-shaped object. The surface of the support includes concentric annular projections for supporting the wafer. Between the projections there is at least one aperture from which a passage extends to a vacuum producing device housed inside the support. As a result of the prevailing vacuum beneath the projections, the object is held in contact with the support and prevented from moving in a direction parallel to the surface, without requiring lateral supports. The compressed gas that creates the vacuum is ejected from the annular nozzle to clean the edges of the wafer-shaped object.
申请公布号 EP0838083(A1) 申请公布日期 1998.04.29
申请号 EP19960908907 申请日期 1996.04.01
申请人 SEZ SEMICONDUCTOR-EQUIPMENT ZUBEHOER FUER DIE HALBLEITERFERTIGUNG GESELLSCHAFT M.B.H. 发明人 SUMNITSCH, FRANZ
分类号 H01L21/677;H01L21/00;H01L21/306;H01L21/68;H01L21/683 主分类号 H01L21/677
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