| 摘要 |
PURPOSE:To fill resin simultaneously into each cavity and prepare a molded product of high quality by controlling the temperature of a hot-runner section and a cavity section individually. CONSTITUTION:Heat insulating components 6 and 7 are respectively provided between a hot runner section A and a cavity section B. Also, a heater 8 is installed on the hot-runner section A, while heaters 9 and 10 are installed on the cavity section B. In said structure, when resin is poured in from a pot 5 and flowed into a runner 4, resin reaches the end of the runner at a high speed as temperature gradient is controlled from the pot toward the runner, and is filled into each cavity 2 gradually. Also, as the temperature of the cavity section B is controlled uniformly, molding can be carried out in good conditions. Accordingly, when semi-conductor elements are molded in said molding die, the yield in the molding process is enhanced to increase the production and a semiconductor device of low coat and high quality can be manufactured.
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