| 摘要 |
PROBLEM TO BE SOLVED: To make the substantial heights of gold bumps for gold-gold diffused junctions to be easily increased and to make the thermocompression bonding for the gold-gold diffused junctions to be performed with a relatively low pressure when a semiconductor device is constituted by mounting a semiconductor chip on a circuit board through gold-gold diffused junctions. SOLUTION: Gold bumps 10 on the first connecting pads 2 of a sub-circuit board 1 are formed of gold wires and the gold bumps 16 of a semiconductor chip 11 are also formed of gold wires. The chip 11 is mounted on the circuit board 1 by connecting the gold bumps 16 of the chip 11 to the gold bumps 10 of the circuit board 1 through gold-gold diffused junctions. In this case, the total height of both bumps 10 and 16 can be adjusted to about 50μm or higher. In addition, since the hardness of the gold bumps 10 and 16 formed of pure gold wires is relatively low, the thermocompression bonding for the gold-gold diffused junctions can be performed with a relatively low pressure. |
