| 摘要 |
PROBLEM TO BE SOLVED: To realize uniform face-down bonding through the use of a semiconductor substrate having a level difference on the surface and pillars, in a face-down bonding semiconductor device and its manufacture method, which is suitable for flip-chip-bonding of the semiconductor substrate having electric connection parts different in surface height on an insulating substrate having wiring electrodes. SOLUTION: In the conductive pillars 16 and 17 which electrically and mechanically connect the electric connection parts with different surface height of a semiconductor substrate 11 and the wiring electrodes 19 formed on the surface of an insulating substrate 18, the relatively high pillar 17 has a larger diameter than the relatively low pillar 16. |
