| 摘要 |
PROBLEM TO BE SOLVED: To minimize a mounting area on an electronic product by adhering a multilayer film on an area excluding a bonding pad on a semiconductor chip, connecting a wire between the bonding pad and a circuit pattern, protecting the wire with a sealing material and fusing solder balls to the circuit pattern. SOLUTION: On an area excluding a bonding pad 12 on the top plane of a semiconductor chip 11, a multilayer film 20, which is formed by coating both sides of a conductor circuit pattern 26 with nonconductive films, is adhered by an adhering means 30. Then, a wire 40 is connected between the bonding pad 12 of the semiconductor chip 11 and the circuit pattern 26, the wire 40 is protected by sealing material 50, and solder balls 60 are fused to the circuit pattern 26 so as to extract signals of the semiconductor chip 11 transmitted by the wire 40 to the outside. Thus, at the time of mounting to an electronic product, the mounting area is minimized and a product is miniaturized. |
