FLOOR PANEL INTEGRATED HEAT INSULATION MATERIAL WITH SOUND INSULATION MATERIAL, AND EXECUTION METHOD OF DOUBLE FLOOR USING IT,申请号JP19960172858-传众专利搜索

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发明名称	FLOOR PANEL INTEGRATED HEAT INSULATION MATERIAL WITH SOUND INSULATION MATERIAL, AND EXECUTION METHOD OF DOUBLE FLOOR USING IT
摘要
申请公布号	JPH102094(A)	申请公布日期	1998.01.06
申请号	JP19960172858	申请日期	1996.06.13
申请人	TAISEI DENKI KOGYO:KK	发明人	HIRAKURI HIROAKI
分类号	E04F15/00;E04F15/024;(IPC1-7):E04F15/024	主分类号	E04F15/00
代理机构		代理人
主权项
地址

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