发明名称 ENCLOSURE FOR ELECTRONIC EQUIPMENT
摘要 An electronic enclosure comprising a casing, a sealed thermal chamber within the casing housing electronic components. A heat exchanger (4) is mounted in the casing externally of the chanber, with a first duct (2) leading from the thermal chamber to the heat exchanger and a second duct (6) leading from the heat exchanger back to the thermal chamber. A fan (7, 8) forces air from the chamber through the first duct to the heat exchanger and back to the thermal chamber through the second duct. The heat exchanger is an element (4) comprising a thermally conductive tubular member (11) having a plurality of thermally conductive fins (12) extending from its external surface, and a plurality of thermally conductive rods (13) which extend from the internal surface of the tubular member and are circumferentially and axially staggered.
申请公布号 WO9750282(A1) 申请公布日期 1997.12.31
申请号 WO1997GB01691 申请日期 1997.06.25
申请人 REDDICLIFFE, EDWARD, A. 发明人 REDDICLIFFE, EDWARD, A.
分类号 F28F1/12;F28F1/42;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28F1/12
代理机构 代理人
主权项
地址