PREPREG, PROCESS FOR PREPARING THE SAME, AND SUBSTRATE FOR PRINTED CIRCUIT AND LAMINATE FOR PRINTED CIRCUIT MADE THEREFROM

摘要

PROBLEM TO BE SOLVED: To produce a prepreg comprising a para-oriented arom. poilyamide film impregnated with a thermoplastic resin and/or a thermosetting resin, and a substrate for a printed circuit and a laminate for a printed circuit made therefrom. SOLUTION: A film is formed from a solution contg. 1 to 10wt.% paraoriented arom. polyamide having an intrinsic viscosity of 1.0 to 2.8dl/g and 1 to 10wt.% chloride of an alkali metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent. The film is maintained at a temp. of 20 deg.C or above or -5 deg.C or below to precipitate the para-oriented arom. polyamide from the film. The film prepd. in this step is immersed in an aq. soln. or an alcoholic soln. to elute the solvent and the chloride, followed by drying to prepare a porous paraaramide film. The film is impregnated with a thermoplastic resin and/or a thermosetting resin to prepare a prepreg.