发明名称 FLOW SENSOR
摘要 <p>PROBLEM TO BE SOLVED: To reduce a heat loss of a flow sensor having a structure wherein a heating body is positioned at a support part of a bridging structure. SOLUTION: A heating body 5 is positioned at the center of a support part 4, not on the surface of a base 2, so as to prevent a heat loss due to direct conduction of heat generated by the heating body 5 to the base 2. The support part 4 is insulated thermally from the base 2 by opening holes 8 so as to reduce also the heat loss due to conduction of the heat from the heating body 5 to the base 2 by the support part 4. Wirings 6 positioned outside the opening holes 8 are so formed as to have a large width so as to prevent also the heat loss due to heating of these wirings 6.</p>
申请公布号 JPH09304142(A) 申请公布日期 1997.11.28
申请号 JP19960117443 申请日期 1996.05.13
申请人 RICOH CO LTD;RICOH SEIKI CO LTD;RICOH ELEMEX CORP 发明人 NAKAYAMA YOSHINOBU
分类号 G01P5/12;G01F1/68;G01F1/692;(IPC1-7):G01F1/68 主分类号 G01P5/12
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