发明名称 |
Modification of epoxy resins with urethane prepolymer for electronic encapsulation |
摘要 |
A modified epoxy resin is prepared by mixing an isocyanate terminated urethane prepolymer with an epoxy resin in reactive conditions. The modified epoxy resin has a low internal stress when it is cured due to the flexible backbone of the urethane prepolymer incorporated therein, and has a high glass transition temperature due to a rigid oxazolidone structure formed via the epoxy ring opening with the isocyanate groups, and thus is useful as an electronic encapsulant.
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申请公布号 |
US5686541(A) |
申请公布日期 |
1997.11.11 |
申请号 |
US19950557294 |
申请日期 |
1995.11.14 |
申请人 |
NATIONAL SCIENCE COUNCIL |
发明人 |
WANG, CHUN-SHAN;HO, TSUNG-HAN |
分类号 |
C08G18/00;C08G18/10;C08G59/28;C08G59/30;H01B3/30;H01B3/40;(IPC1-7):C08G59/00;C08L75/04 |
主分类号 |
C08G18/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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