Low-loss, low-inductance interconnect for microcircuits

摘要

A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.