发明名称 |
Assembly technique for an image sensor array |
摘要 |
A package design and a method of assembling an array of CCD image devices on a substrate to provide an assembly with an optically flat surface. A tolerance of approximately between 2 and 3 microns is achieved by a process requiring less finishing of the substrates used by conventional processes. The assembly package can be used to bond an array of image sensors on a substrate having less than optimum flatness while still maintaining the optical surfaces of the image sensors within a single focal plane.
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申请公布号 |
US5670009(A) |
申请公布日期 |
1997.09.23 |
申请号 |
US19950395750 |
申请日期 |
1995.02.28 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
TARN, TERRY;BAILEY, THOMAS G. |
分类号 |
H04N5/225;H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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