发明名称 |
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
摘要 |
An method for depositing solder onto the pad-on and pad-off via contacts of a substrate is disclosed. In one embodiment the present invention includes positioning a mask having a first opening of a first diameter and a second opening of a second diameter over a substrate having both pad-on and pad-off via contacts. The substrate is positioned over the substrate such that the first opening is positioned over the pad-on via contact and the second opening is positioned over the pad-off via contact. Solder of a first volume and solder of a second volume are deposited onto the pad-on and pad-off via contacts, respectively, by forcing a solder paste through the mask openings. In this manner, solder bumps having a uniform height and volume above the pad-on via contact plane is established after reflowing the deposited solder.
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申请公布号 |
US5660321(A) |
申请公布日期 |
1997.08.26 |
申请号 |
US19960623676 |
申请日期 |
1996.03.29 |
申请人 |
INTEL CORPORATION |
发明人 |
ISHIDA, KENZO;MASHIMOTO, YOHKO;ICHIKAWA, KINYA |
分类号 |
H01L21/48;H01L21/60;H01L23/498;H05K1/11;H05K3/12;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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