ASSEMBLING METHOD AND DEVICE SUITABLE FOR HOLOGRAM MODULE ASSEMBLING DEVICE,申请号JP19960353938-传众专利搜索

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发明名称	ASSEMBLING METHOD AND DEVICE SUITABLE FOR HOLOGRAM MODULE ASSEMBLING DEVICE
摘要
申请公布号	JPH09192951(A)	申请公布日期	1997.07.29
申请号	JP19960353938	申请日期	1996.12.19
申请人	L G DENSHI KK	发明人	SHIYON U NO
分类号	B23P21/00;G11B7/135;(IPC1-7):B23P21/00	主分类号	B23P21/00
代理机构		代理人
主权项
地址

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