发明名称 |
CERAMIC BOARD, MANUFACTURE THEREOF AND SPLIT CIRCUIT BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To enhance reliability in the connection of end face electrode and an insulating base body by preventing the end face electrode from stripping at the time of handling a split circuit board. SOLUTION: The ceramic board comprises an insulating basic body 13 comprising a laminate of a plurality of ceramic insulating layers, an inner wiring formed between the insulating layers, split grooves 7 made in the surface of insulating basic body 13 and a conductive member 21 for forming an end face electrode 2 provided in the thickness direction of insulating basic body 13. The insulating basic body 13 is split along the split grooves 7 to produce split circuit boards 1 each having a plurality of end face electrodes 2. The conductive member 21 has substantially U-shape and the conductive member 21 of adjacent split circuit boards 1 are disposed on the opposite sides of the split groove 7 at a predetermined interval while facing each other.</p> |
申请公布号 |
JPH09186458(A) |
申请公布日期 |
1997.07.15 |
申请号 |
JP19950342255 |
申请日期 |
1995.12.28 |
申请人 |
KYOCERA CORP |
发明人 |
FUKAMIZU NORIMITSU;MATSUMOTO YUZURU;NAKAMIYA MICHINOBU;IMOTO AKIRA |
分类号 |
H05K1/11;H05K1/02;H05K1/03;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|