| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with reliability for a long time, by reducing shearing distortion caused at an end part of resin formed around a semiconductor element. SOLUTION: A semiconductor device 10 includes a circuit wiring board 2 and a semiconductor element 1 mounted on the board 2 with a bump electrode 3. A space between the board 2 and the semiconductor element 1 and a space around the semiconductor element 1 are sealed with a resin containing inorganic filler. The resin part includes a first resin 6 in a space surrounded with most outer bumps 3 in a circumferential part of the semiconductor element 1 and a second resin 7 in a space not surrounded with the most outer bumps 3. In addition, at least one index out of a containing ratio of inorganic filler, a maximum size of grain or a mean size of grain of the first resin 6 is made larger than that of the second resin 7.
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