| 摘要 |
Disclosed herein is a resin transfer molding apparatus including a female mold member having a rigid surface including a main surface portion, and a recessed surface portion extending inwardly from and bordered by the main portion to define a recessed area, and a male mold member including a structure which is adapted to be drawn into close association with the rigid surface of the female mold member in response to the application of vacuum therebetween and which includes a member which is at least partially flexible and which includes an inner surface located, during the application of vacuum, in relatively adjacent opposing relation to the main surface portion of the female mold member and in relatively spaced relation to the recessed surface portion, and a segment which is relatively rigid, which has a shape conforming to the recessed area, which is fixedly bonded to the inside surface of the member, and which is located, during the application of vacuum, in relatively adjacent opposing relation to the recessed surface portion of the female mold member.
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