| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness and contactability between an IC chip and a printed board in an IC module for IC card of face down form using an anisotropic conductive adhesive film. SOLUTION: Values of α, β and γ are set to hold the relation of γ>=α+β, where α represents the thickness of a bump portion 14 to be formed on an IC chip 14, βrepresents the thickness of a wiring pattern layer 16 of a printed board, and γ represents the thickness of an anisotropic conductive adhesive film 15 to be used. Thus, an IC module having excellent adhesiveness and contactability may be provided. By loading this IC module on an IC card, an IC card exhibiting high reliability may provided. |
