| 摘要 |
PROBLEM TO BE SOLVED: To realize a thermal treatment equipment which is capable of carrying out a thermal treatment in a stable atmosphere by a method wherein an outer and an inner case are provided, a hot plate is disposed inside the inner case, and a gas atmosphere supply source such as an air processor or the like which feeds gas atmosphere regulated in temperature and humidity is connected to the outer case. SOLUTION: A thermal treatment equipment 1 comprises an outer case 2, an inner case 3, and an air processor 4 which controls gas atmosphere in temperature and humidity, wherein the opening 2a of a piping 8 is provided to the upside of the outer case 2, an opening 3a which introduces gas atmosphere taken into the outer case 2 into the inner case 3 is provided to the base of the inner case 3. As the opening 3a is provided distant from the opening 2a, gas atmosphere introduced into the outer case 2 is prevented from coming direct into contact with a semiconductor wafer W supported by pins 10 on a hot plate 9 provided inside the inner case 3. |
