发明名称 Method and apparatus inspecting bonding-wire status using a plurality of light sources
摘要 While relatively transporting a wire to be inspected and a unit including a first light source for emitting a first beam, a second light source for emitting a second beam which intersects with said first beam at a predetermined reference position, and a photodetector for detecting reflection light of said first and second beams derived from said first and second light sources respectively, a relative position between said unit and said wire is detected as a first position when said first beam is reflected from said wire. Then, while relatively moving said unit and said wire, another relative position between said unit and said wire is detected as a second position when said second beam is reflected from said wire. Then, a height of said wire from said reference position is calculated based on an interval between said first and second positions.
申请公布号 US5621218(A) 申请公布日期 1997.04.15
申请号 US19950463743 申请日期 1995.06.05
申请人 NEC CORPORATION 发明人 TANAKA, YOSHIHARU
分类号 G01B11/24;G01B11/245;G01N21/956;H01L21/60;H01L21/66;H01S3/00;(IPC1-7):G01B11/24 主分类号 G01B11/24
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