发明名称 |
A COOLING SYSTEM FOR INTEGRATED CIRCUIT CHIPS IN ELECTRONIC SYSTEMS |
摘要 |
A computer system, such as a notebook computer, that includes a lid (114) mounted on a base (111). Mounted within the lid assembly (114) are an LCD panel (101), an insulating layer (102) coupled to the LCD panel, a circuit board (103) with heat producing electronic components, and a heat plate (104) coupled to a back casing (105). An air space is provided between the insulating layer and the circuit board for the flow of cooling air. A mechanism may be provided to eliminate the air space when the lid assembly is closed over the base.
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申请公布号 |
WO9712313(A1) |
申请公布日期 |
1997.04.03 |
申请号 |
WO1996US15352 |
申请日期 |
1996.09.25 |
申请人 |
INTEL CORPORATION;HALEY, KEVIN;O'CONNOR, MICHAEL |
发明人 |
HALEY, KEVIN;O'CONNOR, MICHAEL |
分类号 |
G06F1/20;H05K7/20;(IPC1-7):G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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