发明名称 A COOLING SYSTEM FOR INTEGRATED CIRCUIT CHIPS IN ELECTRONIC SYSTEMS
摘要 A computer system, such as a notebook computer, that includes a lid (114) mounted on a base (111). Mounted within the lid assembly (114) are an LCD panel (101), an insulating layer (102) coupled to the LCD panel, a circuit board (103) with heat producing electronic components, and a heat plate (104) coupled to a back casing (105). An air space is provided between the insulating layer and the circuit board for the flow of cooling air. A mechanism may be provided to eliminate the air space when the lid assembly is closed over the base.
申请公布号 WO9712313(A1) 申请公布日期 1997.04.03
申请号 WO1996US15352 申请日期 1996.09.25
申请人 INTEL CORPORATION;HALEY, KEVIN;O'CONNOR, MICHAEL 发明人 HALEY, KEVIN;O'CONNOR, MICHAEL
分类号 G06F1/20;H05K7/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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