| 摘要 |
<p>PROBLEM TO BE SOLVED: To simply and securely separate wafers from a wafer laminate one by one by deflecting upward an edge of the uppermost layer wafer of the wafer laminate, and blowing a fluid between the lower surface of the uppermost layer wafer and the upper surface of the adjacent lower side wafer to lift the uppermost layer wafer. SOLUTION: Suction means 22 is actuated to suck a peripheral part of the upper surface of the uppermost layer wafer W and hence to deflect upward a peripheral edge of the uppermost layer wafer W. At this time, even when the uppermost layer wafer W is positioned slantingly, a support plate is mounted on a movable member pivotally so that the uppermost wafer W is sucked following the inclination of the uppermost layer wafer W and is hence further lifted. Furthermore, a fluid is injected from fluid injection means 24 to a gap D formed between the peripheral part of the wafer W and a peripheral part of an adjacent lower side wafer W. Hereby, surface tension between the uppermost layer wafer W and the adjacent lower side wafer W is lowered, and hence they are mutually easily separated.</p> |
