发明名称 Ground plane routing
摘要 A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.
申请公布号 US5585162(A) 申请公布日期 1996.12.17
申请号 US19950491120 申请日期 1995.06.16
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 SCHUELLER, RANDOLPH D.
分类号 H05K3/34;H01L21/60;H01L23/12;H05K1/00;H05K1/02;H05K1/11;H05K3/28;H05K3/36;(IPC1-7):B32B9/00 主分类号 H05K3/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利