| 摘要 |
PURPOSE: To supply a highly reliable bonding fine wire for high density semiconductor mount. CONSTITUTION: This insulation coating bonding fine wire is formed by coating a surface of a metallic wire wherein breakage strength of a fine wire broken by a tension test in a metallic wire only is more than 88×10<6> N/m<2> and less than 4.76×10<6> N/m<2> with an insulation film of a high polymer material. Thereby, an insulation coating bonding fine wire which can manufacture a reliable semiconductor which is excellent in joining property by bonding and in yield is provided. |
