发明名称 |
CLEANING METHOD |
摘要 |
PURPOSE: To obtain a cleaning method which can readily remove flux after soldering and a hot-melt adhesive after polishing and cutting steps from various machines and parts and can reduce industrial wastes generated in a cleaning step. CONSTITUTION: Cleaning is performed by using a cleaning fluid comprising a mixture of a water-soluble glycol ether compound (A) selected from the group consisting of 1-4C aliphatic alcohol/ethylene oxide (2mol) adducts and 1-2C aliphatic alcohol/propylene oxide (2mol) adducts and an 11-13C paraffinic hydrocarbon (B), with a difference in the average boiling point thereof being±10 deg.C at 760mmHg, at a weight ratio of component A to component B of (50 to 90):(50 to 10). The fluid after cleaning is regenerated by distillation and reused. |
申请公布号 |
JPH08269496(A) |
申请公布日期 |
1996.10.15 |
申请号 |
JP19950071424 |
申请日期 |
1995.03.29 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD;DAI ICHI KOGYO SEIYAKU CO LTD |
发明人 |
SHIINO TORU;SHINODA KENICHI;SONODA NOBUO;KONO TAKESHI;NABESHIMA TOSHIICHI;KIKAZAWA SHIGERU |
分类号 |
B23K1/00;C09J5/00;C11D7/50;(IPC1-7):C11D7/50 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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