发明名称 High density integrated semiconductor device and manufacturing method thereof
摘要 In a MOS type semiconductor device, a source region, a channel region and a drain region of a MOS type device are arranged on the same plane, while a gate electrode is also arranged on the same plane adjacent to the channel region. Another set of a source region, a channel region and a drain region may also be arranged on the same plane and the latter MOS device Is arranged to the gate electrode. This the of device may be constructed as a CMOS type device. In another type of semiconductor device, the above-mentioned type plane arrangement of the source, channel and drain regions are layered via an insulator layer, while a gate electrode is provided vertically so as to be adjacent to the two channel regions.
申请公布号 US5565368(A) 申请公布日期 1996.10.15
申请号 US19950370289 申请日期 1995.01.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TSUJI, KAZUHIKO
分类号 H01L27/092;(IPC1-7):H01L21/265 主分类号 H01L27/092
代理机构 代理人
主权项
地址