| 摘要 |
PROBLEM TO BE SOLVED: To prevent short-circuit of contact pads in a plating process and to eliminate additional processes by electrically connecting a plating bar and a conducting track and a contact pad and a conducting track by a conducting via. SOLUTION: This device is constituted of contact pads 22 and 23 arranged on the surface of a wiring board at an interval and a printed wiring board 12 having a plating bar. In a conducting track in the printed wiring board 12, the first end part is positioned at the plating bar, and the second end part is positioned at the contact pads 22 and 23. They are located at the plating bar and the contact pads 22 and 23. The plating bar and an inner track 34 are electrically connected by a first conducting via 40 extending between the plating bar and the first end part of the inner track 34. The inner track 34 and the contact pads 22 and 23 are electrically connected by the second conducting via 40 extending between the contact pads 22 and 23 and the second end part of the inner track 34. |
